GBu4001A IST Coupon Information – Single Level Buried Vias (With capacitance holes)
A generic Interconnect Stress Test (IST) Test Coupon containing Plated Through Hole and Buried Via Technologies on a 5.0” (126.9mm) X 0.6” (15.2mm) coupon with a total thickness up to .125” (3.2mm) and limited to a minimum of 8 layers. The buried via structure can have multiple layers, located between layers 4 and N-3. This coupon is designed on a small grid, .040” (1mm). The maximum hole/pad size is .015” (.38mm) and pad size is .028” (.71mm) for both power and sense circuits; decreasing these feature sizes will not affect the coupon functionality but increasing these feature sizes may result in shorts or excessively small clearances. Instructions on how to create a custom IST coupon for a specific product are included.
GC40002A IST Coupon Information – Buried (Core) Vias (with capacitance holes)
A generic Interconnect Stress Test (IST) Test Coupon containing Plated Through Hole and Buried (Core) Via Technologies on a 5.0” (126.9mm) X 0.6” (15.2mm) coupon with a total thickness up to .125” (3.2mm) and limited to a minimum of 6 layers. The core vias run between layers 2 and N-1 only. This coupon is designed on a small grid, .040” (1mm). The maximum hole/pad size is .015” (.38mm) and pad size is .028” (.71mm) for both power and sense circuits; decreasing these feature sizes will not affect the coupon functionality but increasing these feature sizes may result in shorts or excessively small clearances. Instructions on how to create a custom IST coupon for a specific product are included.
If a design with internal buried vias is needed, please refer to GBu4001A. This can accommodate buried vias anywhere between layer 4 and n-3.
GBu4002B Coupon Information – Double Level Buried Vias (with capacitance holes)
A generic Interconnect Stress Test (IST) Test Coupon containing Plated Through Hole and Buried Via Technologies on a 5.0” (126.9mm) X 0.6” (15.2mm) coupon with a total thickness up to .125” (3.2mm) and limited to a minimum of 8 layers. The two buried via structures can each have multiple layers, located between layers 4 and N-3. This coupon is designed on a small grid, .040” (1mm). The maximum hole/pad size is .015” (.38mm) and pad size is .028” (.71mm) for both power and sense circuits; decreasing these feature sizes will not affect the coupon functionality but increasing these feature sizes may result in shorts or excessively small clearances. Instructions on how to create a custom IST coupon for a specific product are included.
Note: If this generic design is not suitable to construct a coupon consistent with the actual product, custom coupon design services are available.
