Interconnect Separation

This animation represents a typical interconnect separation failure. The animation serves to establish the relative effect of a thermal excursion on a PWB heated to assembly temperatures. This animation demonstrates how the crack at the copper to barrel interface opens up under a thermal excursion and then closes up again afterwards.

Note in this animation the separation closes backup. The inner layer copper rotates up creating a wedge shaped gap as the pcb is heated up before closing up again during the cool down. The crack opens up from one side (i.e. not from both sides. This type of failure happens at the interface of the copper to the barrel of the hole. .

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