GP32001A IST Coupon Information (Backplane; through hole; with capacitance holes)
A generic Interconnect Stress Test (IST) Test Coupon containing Plated Through Hole Technology, on a 5.0” (127 mm) X 0.7” (17.8 mm) coupon with a total thickness greater than .125” (3.2mm) for Back-Plane style PWB’s with a minimum of 10 layers. This coupon is designed with a small grid, .032” (.8mm). The maximum drilled hole is .012” (0.3mm) and pad size is .022” (0.56mm) for both power and sense circuits. Decreasing these feature sizes will not affect the coupon functionality, but increasing these feature sizes may result in shorts or excessively small clearances. Instructions on how to create a custom IST coupon for a specific product are included.
Note: If this generic design is not suitable to construct a coupon consistent with the actual product, custom coupon design services are available.
GP32400A IST Coupon Information (Through Hole; with capacitance holes)
A generic Interconnect Stress Test (IST) Test Coupon containing Plated Through Hole Technology on a 5.0” (126.9mm) X 0.7” (17.8mm) coupon with a total thickness greater than .125” (3.2mm) for Back-Plane style PWB’s with a minimum of 10 layers. This coupon is designed on two integrated grid sizes, .040” (1mm) and .032” (.8mm). The hole/pad size for the .040” (1mm) grid is .010” (.25mm) drilled and pad size is .024” (.61mm), on both power and sense circuits. The hole/pad size for the .032” (2mm) grid is .010” (.25mm) drilled and pad size is .024” (.61mm), on both power and sense circuits. Decreasing these feature sizes will not affect the coupon functionality but increasing these feature sizes may result in shorts or excessively small clearances. Instructions on how to create a custom IST coupon for a specific product are included.
Note: If this generic design is not suitable to construct a coupon consistent with the actual product, custom coupon design services are available.
GP40002B IST Coupon Information (Backplane; with capacitance holes)
A generic Interconnect Stress Test (IST) Test Coupon containing Plated Through Hole Technology, on a 5.0” (127 mm) X 0.85” (21.5 mm) coupon with a total thickness greater than .125” (3.2mm) for Back-Plane style PWB’s with a minimum of 10 layers. This coupon is designed with a small grid, .040” (1mm). The maximum drilled hole is .015” (.38mm) and pad size is .027” (.685mm) for both power and sense circuits. Decreasing these feature sizes will not affect the coupon functionality, but increasing these feature sizes may result in shorts or excessively small clearances. Instructions on how to create a custom IST coupon for a specific product are included.
Note: If this generic design is not suitable to construct a coupon consistent with the actual product, custom coupon design services are available.
GP60001A IST Coupon Information (Backplane; with capacitance holes)
A generic Interconnect Stress Test (IST) Test Coupon containing Plated Through Hole Technology, on a 5.0” (126.9 mm) X 0.75” (19 mm) coupon with a total thickness greater than .125” (3.2mm) for Back-Plane style PWB’s with a minimum of 10 layers. This coupon is designed with a .060” (1.5mm) grid. The maximum drilled hole for the Power circuit is .030” (76mm) and pad size is .042” (1.06mm). On the Sense circuit the maximum drilled hole is .016” (41mm) and pad size is .028” (71mm). Decreasing these feature sizes will not affect the coupon functionality, but increasing these feature sizes may result in shorts or excessively small clearances. Instructions on how to create a custom IST coupon for a specific product are included.
Note: If this generic design is not suitable to construct a coupon consistent with the actual product, custom coupon design services are available.
GP50001B IST Coupon Information (Backplane; with capacitance holes)
A generic Interconnect Stress Test (IST) Test Coupon containing Plated Through Hole Technology, on a 6.0” (152 mm) X 1.0” (25 mm) coupon with a total thickness greater than .125” (3.2mm) for Back-Plane style PWB’s with a minimum of 10 layers. This coupon is designed with a small grid, .050” (1.27mm). The maximum drilled hole is .020” (.51mm) and pad size is .032” (.81mm) for both power and sense circuits. Decreasing these feature sizes will not affect the coupon functionality, but increasing these feature sizes may result in shorts or excessively small clearances. Instructions on how to create a custom IST coupon for a specific product are included.
Note: If this generic design is not suitable to construct a coupon consistent with the actual product, custom coupon design services are available.
GP80001C IST Coupon Information (Backplane; with capacitance holes)
A generic Interconnect Stress Test (IST) Test Coupon containing Plated Through Hole Technology, on a 5.0” (126.9 mm) X 0.8” (20.3 mm) coupon with a total thickness greater than .125” (3.2mm) for Back-Plane style PWB’s with a minimum of 10 layers. This coupon is designed with a .080” (2mm) connector style grid. The maximum-drilled hole for the Power and Sense circuits is .056” (1.42mm) and pad size is .068” (1.73mm). Decreasing these feature sizes will not affect the coupon functionality, but increasing these feature sizes may result in shorts or excessively small clearances. Instructions on how to create a custom IST coupon for a specific product are included.
Note: If this generic design is not suitable to construct a coupon consistent with the actual product, custom coupon design services are available.
